Backplane Overview

Defence Products > Electronic Assembly > NAFI Interconnection Systems > Backplane Overview

Backplane Specs

Backplane Overview

Albacom Backplane Systems utilise the Dynamic Retention - "Tuning Fork" press-fit design concept as depicted in the photograph on the previous page.  Central to this concept is the 'eye-of-the-needle', solderless, gas-tight retention feature.  A proven leader in its field, this design is minimally affected by variations in hole size and other process variables, in comparison to other press-fit contacts.  Not only do the two bow shaped springs making up the 'eye-of-the-needle', maintain in it intimate association with the vertical walls of the hole, but they also serve to provide the resiliency necessary to minimise stress related effects, thereby producing a consistently reliable, high quality and dimensionally accurate backplane.

This system is specifically designed to meet the requirements of MIL-C-28859.

A wide range of printed wiring panel designs can be accommodated, including double sided complex multi-layer requirements and an almost unlimited range of flex/rigid combinations.

High density modular insulator arrays are possible due to the low insertion force performance of the contact.  The modular construction of the two and three row 2.54mm x 2.54mm grid insulators facilitates the design of high density row arrays that are compatible with LSI & VLSI (Large and Very Large Scale Integration circuitry).

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